Effect of multistep annealing on mechanical and surface properties of electroplated Cu thin films

Journal of Electronic Materials

Volumn 32, Issue 10, 2003, Pages 1028-1033

  Siker, A K ^a,b   Kumar, Ashok ^a,b   Shukla, P ^a,b   Zantye, P B ^a,b   Sanganaria, M ^c  

^a NNRC   (United States)

^b UNIVERSITY OF SOUTH FLORIDA   (United States)

^c NOVELLUS SYSTEMS INC   (United States)

Author keywords

Chemical mechanical polishing (CMP); Cu film; Interconnect; Nanoindentation

Indexed keywords

ANNEALING; ATOMIC FORCE MICROSCOPY; CHEMICAL MECHANICAL POLISHING; COPPER; ELECTROPLATING; MECHANICAL PROPERTIES; MORPHOLOGY; STRAIN HARDENING; SURFACE ROUGHNESS; TEMPERATURE; TRIBOLOGY;

CONTINUOUS STIFFNESS MEASUREMENT TECHNIQUE; GRAZING INCIDENT X-RAY DIFFRACTION PATTERN; MICROSTRUCTURAL TRANSITION; NANOINDENTATION; SELF-ANNEALING;

THIN FILMS;

EID: 0242368001     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0085-3     Document Type: Article

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