Microstructure of Cu film sputter deposited on TiN

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 18, Issue 6, 2000, Pages 2854-2857

  Furuya, Akira ^a   Ohshita, Yoshio ^a   Ogura, Atsuhi ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER; CRYSTAL MICROSTRUCTURE; CRYSTAL ORIENTATION; GRAIN SIZE AND SHAPE; SILICA; SPUTTER DEPOSITION; SUBSTRATES; THIN FILMS; TITANIUM NITRIDE; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

INTERDIELECTRIC CAPACITANCE;

SEMICONDUCTING FILMS;

EID: 0034317101     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1310653     Document Type: Article

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