Electrochemical and simulative studies of trench filling mechanisms in the copper damascene electroplating process

Materials Transactions

Volumn 43, Issue 7, 2002, Pages 1593-1598

  Haba, Toshio ^a   Itabashi, Takeyuki ^a   Akahoshi, Haruo ^a   Sano, Akihiro ^a   Kobayashi, Kinya ^a   Miyazaki, Hiroshi ^a  

^a HITACHI LTD   (Japan)

Author keywords

Additive; Copper; Damascene; Electroplating; Large scale integration

Indexed keywords

COMPUTER SIMULATION; COPPER; DIFFUSION; ELECTROCHEMISTRY; LSI CIRCUITS; MATHEMATICAL MODELS; SURFACE TREATMENT;

TRENCH FILLING;

ELECTROPLATING;

EID: 0036630260     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.43.1593     Document Type: Article

References (10)