Advanced encapsulation processing for low cost electronics assembly - a cost analysis

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 1997, Pages 50-53

  Pascarella, Nathan W ^a   Baldwin, Daniel F ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; COST EFFECTIVENESS; COSTS; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; FLIP CHIP DEVICES;

COST ANALYSIS; ELECTRONICS ASSEMBLY;

ENCAPSULATION;

EID: 0030717772     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)