Novel chip replacement method of encapsulated flip-chip bonding

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1993, Pages 199-204

  Tsukada, Yutaka ^a   Mashimoto, Yohko ^a   Watanuki, Noriyuki ^a  

^a IBM JAPAN LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRON DEVICE MANUFACTURE; ENCAPSULATION; INTEGRATED CIRCUITS; SOLDERING;

CARRIER BUMPS; CHIP REPLACEMENT METHOD; FLIP CHIP BONDING;

ELECTRONICS PACKAGING;

EID: 0027321941     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)