Effects of underfill encapsulant on the mechanical and electrical performance of a functional flip chip device

Journal of Electronics Manufacturing

Volumn 7, Issue 4, 1997, Pages 269-277

  Lau, John ^a   Chang, Chris ^a   Chen, Ray ^a  

^a Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000170102     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0960313197000282     Document Type: Article

References (24)

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5. st ASME/JSME Electronic Packaging Conference (1992), pp. 385-392.
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