Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 571-582

  Lau, John H ^a   Lee, S W Ricky ^a   Chang, Chris ^a   Ouyang, Chien ^a  

^a Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; ELASTIC MODULI; ENCAPSULATION; FLIP CHIP DEVICES; FRACTURE MECHANICS; INTERFACES (MATERIALS); MASKS; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERING; STRAIN; THERMAL EXPANSION;

INTERFACIAL DELAMINATION; SOLDER BUMP; SOLDER MASK; UNDERFILL ENCAPSULANTS; UNDERFILL MATERIALS;

ELECTRONICS PACKAGING;

EID: 0032643252     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (12)