High performance underfills development - materials, processes and reliability

IEEE International Symposium on Polymeric Electronics Packaging, PEP

Volumn , Issue , 1997, Pages 300-306

  Nguyen, L ^a   Hoang, L ^a   Fine, P ^a   Shi, S ^a   Vincent, M ^a   Wang, L ^a   Wong, C P ^a   Tong, Q ^a   Ma, M ^a   Humphreys, R ^a   Savoca, A ^a  

^a NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; FILLERS; FLIP CHIP DEVICES; SEMICONDUCTOR DEVICE STRUCTURES; SERVICE LIFE; SOLDERING;

SOLDER LIFE; UNDERFILLERS;

ELECTRONICS PACKAGING;

EID: 0031369754     PISSN: 14029855     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)