High performance no flow underfills for low-cost flip-chip applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 850-858

  Wong, C P ^a   Shi, S H ^a   Jefferson, G ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVES; CATALYSTS; COMPOSITION EFFECTS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; ENCAPSULATION; EPOXY RESINS; GLASS TRANSITION; REACTION KINETICS; SOLDERED JOINTS; THERMAL EXPANSION;

DYNAMIC MECHANICAL ANALYZERS (DMA); THERMAL COEFFICIENT OF EXPANSION (TCE); THERMOMECHANICAL ANALYZERS (TMA);

FLIP CHIP DEVICES;

EID: 0030718912     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)