Low cost flip chip processing and reliability of fast-flow, snap-cure underfills

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 61-70

  Houston, Paul N ^a   Baldwin, Daniel F ^a   Deladisma, Marnico ^a   Crane, Lawrence N ^a   Konarski, Mark ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT TESTING; PRINTED CIRCUIT BOARDS; RELIABILITY; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; THERMAL EXPANSION;

FLIP CHIP ON BOARD ASSEMBLY; MOISTURE SENSITIVITY TESTING; SECOND REFLOW PASS; SNAP CURE UNDERFILLS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0032657604     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (2)