Novel fast cure and reworkable underfill materials

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 43-48

  Tong, Q ^a   Ma, B ^a   Savoca, A ^a   Nguyen, L ^a   Fine, P ^a   Cobb, B ^a  

^a NATIONAL STARCH AND CHEMICAL COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CLEANING; CROSSLINKING; CURING; GLASS TRANSITION; MECHANICAL PROPERTIES; POLYMERIZATION; TEMPERATURE; THERMAL EXPANSION; THERMOPLASTICS;

CHIP REMOVAL; IN-SITU POLYMERIZATION CHEMISTRY; REWORKABILITY; UNDERFILL MATERIALS;

ELECTRONICS PACKAGING;

EID: 0032633417     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (4)