Development of reworkable underfills, materials, reliability and processing

National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

Volumn 1, Issue , 1999, Pages 144-151

  Crane, Lawrence ^a   Torres Filho, Afranio ^a   Yaeger, Erin ^a   Heuel, Mario ^a   Ober, Christopher K ^a   Yang, Shu ^a   Chen, Jir shyr ^a   Johnson, R Wayne ^a  

^a Loctite Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; DIFFERENTIAL SCANNING CALORIMETRY; FLIP CHIP DEVICES; FOURIER TRANSFORM INFRARED SPECTROSCOPY; INTEGRATED CIRCUIT LAYOUT; MICROPROCESSOR CHIPS; PRINTED CIRCUIT BOARDS; SOLVENTS; THERMAL EXPANSION;

BALL GRID ARRAYS (BGA); CHIP SCALE PACKAGES (CSP); COEFFICIENT OF THERMAL EXPANSION (CTE); KNOWN GOOD DIES (KGD);

ELECTRONICS PACKAGING;

EID: 0032644451     PISSN: 04700155     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (6)