Evaluation of fast-flow, fast-cure underfills for flip chip on organic substrates

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 540-545

  Wun, Kai Lam Bill ^a   Margaritis, George ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGENTS; DYES; EPOXY RESINS; FILLERS; GLASS TRANSITION; MECHANICAL PROPERTIES; SEMICONDUCTING SILICON; SOLDERED JOINTS; THERMAL EXPANSION; THERMODYNAMIC PROPERTIES;

COEFFICIENT THERMAL EXPANSION MATCHING; CURING AGENT; FLIP CHIP ASSEMBLY; ORGANIC SUBSTRATES; SOLDER BUMPS; UNDERFILLS; WETTING AGENT;

FLIP CHIP DEVICES;

EID: 0029710406     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (3)