Reworkable encapsulation for flip-chip packaging

American Society of Mechanical Engineers, EEP

Volumn 10-2, Issue , 1995, Pages 781-787

  Pompeo, Frank L ^a   Call, Anson J ^a   Coffin, Jeffrey T ^a   Buchwalter, Stephen L ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURED EPOXY; FLIP CHIP SOLDER JOINTS; REWORKABLE ENCAPSULATION;

ENCAPSULATION; EPOXY RESINS; FLIP CHIP DEVICES; RELIABILITY; SOLDERED JOINTS; THERMAL EXPANSION;

ELECTRONICS PACKAGING;

EID: 0004682797     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)