SMT compatible no-flow underfill for solder bumped flip chip on low-cost substrates

Journal of Electronics Manufacturing

Volumn 8, Issue 3, 1998, Pages 151-164

  Lau, John H ^a   Chang, Chris ^a   Ouyang, Chien ^a  

^a Express Packaging Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SOLDERING; SUBSTRATES; SURFACE MOUNT TECHNOLOGY;

EPOXY-BASED NO-CLEAN FLUX; EPOXY-BASED NON-CONDUCTIVE MATERIALS;

FLIP CHIP DEVICES;

EID: 0032259478     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/s0960313198000148     Document Type: Article

References (49)

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