Low-temperature wafer-scale 'warm' embossing for mix & match with UV-lithography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4688, Issue 1, 2002, Pages 223-231

  Schulz, Hubert ^a   Wissen, Matthias ^a   Roos, Nils ^a   Scheer, Hella Christin ^a   Pfeiffer, Karl ^a,b   Gruetzner, Gabi ^a,b  

^a UNIVERSITY OF WUPPERTAL   (Germany)

^b MICRO RESIST TECHNOLOGY GMBH   (Germany)

Author keywords

Low temperature embossing; Mix and match; Nanoimprint lithography; UV lithography; Wafer scale

Indexed keywords

EPOXY RESINS; LOW TEMPERATURE EFFECTS; MOLECULAR WEIGHT; PLASTICIZERS; ULTRAVIOLET RADIATION;

NANOIMPRINT LITHOGRAPHY; ULTRAVIOLET LITHOGRAPHY;

LITHOGRAPHY;

EID: 0036378969     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.472295     Document Type: Article

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