Nanoimprint lithography with a commercial 4 inch bond system for hot embossing

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4343, Issue 1, 2001, Pages 427-435

  Roos, Nils ^a   Luxbacher, Thomas ^b   Glinsner, Thomas ^b   Pfeiffer, Karl ^c   Schulz, Hubert ^a   Scheer, Hella C ^a  

^a UNIVERSITY OF WUPPERTAL   (Germany)

^b Electronic Visions Group   (Australia)

^c MICRO RESIST TECHNOLOGY GMBH   (Germany)

Author keywords

Anti sticking layer; Fluoroalcyltrichlorosilane; Hot embossing; Lithography; Nanoimprint; Wafer bonder; Wafer scale

Indexed keywords

ETCHING; NANOTECHNOLOGY; POLYMETHYL METHACRYLATES; POLYSILICON; SELF ASSEMBLY; SILICON WAFERS; SUBSTRATES; VISCOELASTICITY;

HOT EMBOSSING LITHOGRAPHY;

LITHOGRAPHY;

EID: 0034758414     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.436661     Document Type: Article

References (20)

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