Performance of 4″ wafer-scale thermoset working stamps in hot embossing lithography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4688, Issue 1, 2002, Pages 232-239

  Roos, Nils ^a   Schulz, Hubert ^a   Fink, Marion ^b   Pfeiffer, Karl ^b   Osenberg, Frank ^a   Scheer, Hella Christin ^a  

^a UNIVERSITY OF WUPPERTAL   (Germany)

^b MICRO RESIST TECHNOLOGY GMBH   (Germany)

Author keywords

Anti sticking; Hot embossing lithography; Nanoimprint; Thermoset; Wafer scale; Working stamps

Indexed keywords

SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON; THERMOSETS; ULTRAVIOLET RADIATION;

HOT EMBOSSING LITHOGRAPHY (HEL);

LITHOGRAPHY;

EID: 0036381279     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.472296     Document Type: Article

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