Reliability of ultra thinning of flip chips for through-silicon analyses

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2002, Pages 198-204

  Tsao, Chun Cheng ^a   LeRoy, Erwan ^a   Saha, Sambit ^b   Ansorge, Lynnette ^b   Potter, Mark E ^b  

^a SCHLUMBERGER   (United States)

^b AGERE SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC IMAGING; ATTENUATION; DEFORMATION; DRY ETCHING; ELLIPSOMETRY; FAILURE ANALYSIS; HEAT LOSSES; INTEGRATED CIRCUITS; LASER BEAMS; OPTICAL MICROSCOPY; PLASMA ETCHING; POLARIZATION; SEMICONDUCTING SILICON; SPECTROMETRY; THIN FILMS; TRANSDUCERS;

ACOUSTIC MICROSCOPY; NEAR-INFRARED (NIR) CONFOCAL MICROSCOPY; REFLECTANCE SPECTROMETRY;

FLIP CHIP DEVICES;

EID: 0036089401     PISSN: 00999512     EISSN: None     Source Type: Journal    
DOI: 10.1109/RELPHY.2002.996636     Document Type: Article

References (20)

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