Silicon Trenching Using Dry Etch Process for Back Side FIB and Probing

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2000, Pages 559-565

  Korchnoi, Valentina ^a   Fenigstein, Amos ^a   Barger, Anastasia ^a  

^a Intel Israel(74) Ltd   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

FOCUSED ION BEAMS (FIB); LASER CHEMICAL ETCHING (LCE); SILICON TRENCHING PROCESS;

COMPUTER DEBUGGING; DRY ETCHING; FAILURE ANALYSIS; HARMONIC GENERATION; ION BEAMS; LASER BEAM EFFECTS; MICROPROCESSOR CHIPS; NEODYMIUM LASERS; PARAMETER ESTIMATION; PHOTOLITHOGRAPHY; PHOTORESISTORS; PLASMA ETCHING; SILICON;

INTEGRATED CIRCUIT LAYOUT;

EID: 0006004395     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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