A New Robust Backside Flip-Chip Probing Methodology

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 1996-November, Issue , 1996, Pages 381-386

  Ullmann, P F ^a   Talbot, C G ^a   Lee, R A ^a   Orjuela, C ^a   Nicholson, R ^a  

^a SCHLUMBERGER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FLIP CHIP DEVICES; LOGIC DEVICES; SOFTWARE TESTING;

DEVICE ANALYSIS; E-BEAMS; E. MECHANICAL; EFFICIENT ANALYSIS; FLIP CHIP; HIGH BANDWIDTH; MECHANICAL PROBING; PIN COUNTS; PROBING TECHNIQUES; WAVEFORMS;

FAILURE ANALYSIS;

EID: 0000005292     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31399/asm.cp.istfa1996p0381     Document Type: Conference Paper

References (9)

1. Extract from article in Circuits Assembly, July 1996, "Is Flip-Chip the Ultimate Package?"
2. W. T. Lee, "Engineering a Device for Electron-Beam Probing", IEEE Design & Test of Computers, June 1989
3. K. Van Doorselaer, U. Swerts, L. Van Den Bempt, "Broadening the Use of Emission Microscopy", ISTFA 1995
4. N. Seliger, P. Habas and E. Gornik, "A Study of Backside Laser-Probe Signals in MOSFETS", 5th European Conference on Electron and Optical Beam Testing, Aug. 1995
5. N.M. Wu, K. Tang, K. De, A. Gunda, "Using FA-Scan Tool for Failure Analysis", ISTFA 1995
6. H. K. Heinrich, D. M. Bloom and B.R. Hemenway, "Noninvasive sheet charge density probe for integrated silicon devices", Appl. Phys. Lett 48 (16), 21, April 1986
7. P. F. Ullmann,"Adapting CAD Databases to the Diagnostic Environment", The Electronic Design Automation & Test Conference-Asia Proceedings, 1994
8. M. Engelhardt, "Design and Characteristics of a Magnetic Collimating Lens Spectrometer for Electron Beam Probing", Microelectronic Engineering 31, 1996, 109-114
9. H. Ximen and C.G. Talbot, "Halogen-Based Selective FIB Milling for IC Probe-Point Creation and Repair", ISTFA 1994