Modeling for solder self-assembled MEMS

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3289, Issue , 1998, Pages 177-184

  Harsh, K ^a   Lee, Y C ^a  

^a UCB 450   (United States)

Author keywords

MEMS; Modeling; Self alignment; Self assembly; Solder

Indexed keywords

COMPUTER SIMULATION; INTERFACIAL ENERGY; OPTIMIZATION; PARAMETER ESTIMATION; SEMICONDUCTOR DEVICE STRUCTURES; SOLDERING ALLOYS; SURFACE TENSION; THREE DIMENSIONAL;

SOFTWARE PACKAGE SURFACE EVOLVER; SURFACE ENERGY MINIMIZATION;

MICROELECTROMECHANICAL DEVICES;

EID: 0032224473     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.305485     Document Type: Conference Paper

References (9)

1. Scratch drive actuator with mechanical links for self-assembly of three dimensional MEMS
2. Self assembled micro-actuated XYZ stages for optical scanning and alignment
3. Soldering for optoelectronic packaging
4. Demonstration of three-dimensional microstructure self-assembly
5. Design of solder joints for self-aligned optoelectronic assemblies
6. Equilibrium of hinged and hingeless structures rotated using surface tension forces
7. Study of soldering technology for liquid-crystal-on-silicon (LCOS) modules