Integration of low dielectric constant materials in advanced aluminum and copper interconnects

Materials Research Society Symposium - Proceedings

Volumn 565, Issue , 1999, Pages 137-149

  Zhao, Bin ^a   Brongo, Maureen ^a  

^a Rockwell Semiconductor Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ASPECT RATIO; CONDUCTIVE MATERIALS; COPPER; INTEGRATED CIRCUIT MANUFACTURE; METALLIZING; PERMITTIVITY; SCANNING ELECTRON MICROSCOPY; ULSI CIRCUITS;

ALUMINUM INTERCONNECTS; COPPER INTERCONNECTS; DUAL DAMASCENE INTERCONNECT INTEGRATION; SPIN RINSE DRYER; SPIN-ON DEPOSITION;

DIELECTRIC MATERIALS;

EID: 0033297548     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-565-137     Document Type: Article

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