Integration of thermally stable, low-k AF4 polymer for 0.18 μm interconnects and beyond

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 1997, Pages 81-82

  Ralston, A R K ^a   Gaynor, J F ^a   Singh, A ^a   Le, L V ^a   Havemann, R H ^a   Plano, M A ^a   Cleary, T J ^a   Wing, J C ^a   Kelly, J ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE MEASUREMENT; CHEMICAL VAPOR DEPOSITION; DIELECTRIC MATERIALS; ELECTRIC CURRENT MEASUREMENT; LEAKAGE CURRENTS; PLASMA APPLICATIONS; POLYMERS;

GAP FILL DIELECTRICS; PARYLENE;

CAPACITORS;

EID: 0030683246     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)