Making the move to dual damascene processing: A look at several different dual damascene processing strategies

Semiconductor International

Volumn 20, Issue 9, 1997, Pages 79-82

  Singer, Peter ^a  

^a NONE

Author keywords

Dual damascene; Interconnects; Multilevel metal

Indexed keywords

CHEMICAL POLISHING; ELECTRIC CONTACTS; ETCHING; PHOTORESISTS; SUBSTRATES;

DIELECTRIC GAP FILL; DUAL DAMASCENE PROCESSING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 30844441658     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. P. Singer, "Low k Dielectrics: The Search Continues," Semiconductor International, May 1996, p. 88.
2. R.C. Iggulden, et al., "The Demonstration of a 0.25 μm Dual Damascene Metallization Scheme Using Forceful," VMIC 1997, p. 49.
3. Y. Morand, "Copper Integration in a Dual Damascene Architecture for Sub-quarter Micron Technology," VMIC 1997, p. 75.