Cu/low-κ dual damascene interconnect for high performance and low cost integrated circuits

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 1998, Pages 28-29

  Zhao, B ^a   Feiler, D ^a   Ramanathan, V ^a   Liu, Q Z ^a   Brongo, M ^a   Wu, J ^a   Zhang, H ^a   Kuei, J C ^a   Young, D ^a   Brown, J ^a   Vo, C ^a   Xia, W ^a   Chu, C ^a   Zhou, J ^a   Nguyen, C ^a  

^a Rockwell Semiconductor Systems ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIELECTRIC MATERIALS; ELECTRIC RESISTANCE; PERMITTIVITY; SEMICONDUCTOR DEVICE MANUFACTURE;

DUAL DAMASCENE INTERCONNECTS;

MICROPROCESSOR CHIPS;

EID: 0031641880     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)