0.1 μm interconnect technology challenges and the SIA roadmap

Materials Research Society Symposium - Proceedings

Volumn 427, Issue , 1996, Pages 3-16

  Seidel, Tom ^a   Zhao, Bin ^a  

^a SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC PROPERTIES OF SOLIDS; ELECTROMIGRATION; INTEGRATED CIRCUIT LAYOUT; PERFORMANCE; PERMITTIVITY; RELIABILITY;

CIRCUIT INTERCONNECTS;

SEMICONDUCTOR MATERIALS;

EID: 0030401885     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-427-3     Document Type: Conference Paper

References (34)