Integration of ultra-low-k xerogel gapfill dielectric for high performance sub-0.18 μm interconnects

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 1997, Pages 77-78

  List, R S ^a   Jin, C ^a   Russell, S W ^a   Yamanaka, S ^a   Olsen, L ^a   Le, L ^a   Ting, L M ^a   Havemann, R H ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; ELECTROMIGRATION; LEAKAGE CURRENTS; PERMITTIVITY; POROSITY; SILICA; THERMODYNAMIC STABILITY;

INTERLAYER DIELECTRIC FILMS (ILD); XEROGELS;

DIELECTRIC FILMS;

EID: 0030649234     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)