On advanced interconnect using low dielectric constant materials as inter-level dielectrics

Materials Research Society Symposium - Proceedings

Volumn 427, Issue , 1996, Pages 415-426

  Zhao, Bin ^a   Wang, Shi Qing ^a   Anderson, Steven ^a   Lam, Robbie ^a   Fiebig, Marcy ^a   Vasudev, P K ^a   Seidel, Thomas E ^a  

^a SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; INTEGRATED CIRCUIT LAYOUT; INTERCONNECTION NETWORKS;

INTER LEVEL DIELECTRICS (ILD); SPIN ON DEPOSITED (SOD) ORGANIC MATERIALS;

DIELECTRIC MATERIALS;

EID: 0030397371     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-427-415     Document Type: Conference Paper

References (27)