Low temperature CVD Al plug and interconnect process for 0.25 μm metallization technologies

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 1996, Pages 42-43

  Fiordalice, R ^a   Blumenthal, R ^a   Fernandes, M ^a   Garcia, S ^a   Gelatos, J ^a   Kawasaki, H ^a   Klein, J ^a   Marsh, R ^a   Ong, T ^a   Venkatraman, R ^a   Weitzman, E ^a   Pintchovski, F ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CHEMICAL VAPOR DEPOSITION; ELECTROMIGRATION; HYDRIDES; LOW TEMPERATURE EFFECTS; METALLIC FILMS; METALLIZING; MICROPROCESSOR CHIPS; MORPHOLOGY; NUCLEATION; SPUTTER DEPOSITION; X RAY DIFFRACTION ANALYSIS;

ALUMINUM FILMS; DIMETHYLALUMINUM HYDRIDE;

ELECTRIC CONNECTORS;

EID: 0029707036     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)