Application of system-level em modeling to high-speed digital 1C packages and PCB's

IEEE Transactions on Microwave Theory and Techniques

Volumn 45, Issue 10 PART 2, 1997, Pages 1847-1856

  Yook, Jong Gwan ^a   Katehi, Linda P B ^a   Sakallah, Karem A ^a   Martin, Ray S ^a   Huang, Lilly ^a   Schreyer, Tim A ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Circuit simulation; Decoupling capacitors; Em modeling; Ground bounce; PCB; SSN; Tiling

Indexed keywords

CAPACITORS; COMPUTER SIMULATION; DIGITAL CIRCUITS; ELECTROMAGNETIC FIELDS; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; PRINTED CIRCUIT BOARDS;

DECOUPLING; GROUND BALANCE;

ELECTRONICS PACKAGING;

EID: 0031249223     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.641782     Document Type: Article

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