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Volumn 29, Issue 11, 1986, Pages 133-134,-136
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HIGH PERFORMANCE MMIC HERMETIC PACKAGING.
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a
M/A COM
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
CERAMIC MATERIALS - APPLICATIONS;
MICROWAVE DEVICES - ELECTRONICS PACKAGING;
HERMETIC PACKAGING;
MMIC;
INTEGRATED CIRCUITS, MONOLITHIC;
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EID: 0022807795
PISSN: 00262897
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (6)
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References (0)
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