FDTD simulation of power/ground bounce and crosstalk in IC packages

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1996, Pages 166-168

  Falconer, Maynard ^a   Tripathi, Vijay ^a  

^a OREGON STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CROSSTALK; CURRENT DENSITY; ELECTRIC CONDUCTIVITY; ELECTRIC FIELDS; ELECTRONICS PACKAGING; FINITE DIFFERENCE METHOD; MAGNETIC FIELDS; TIME DOMAIN ANALYSIS;

FINITE DIFFERENCE TIME DOMAIN SIMULATION; INTEGRATED CIRCUIT PACKAGES; PERFECTLY MATCHED LAYER; POWER GROUND BOUNCE;

INTEGRATED CIRCUITS;

EID: 0030398227     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)