Role of EM modeling in integrated packaging

AP-S International Symposium (Digest) (IEEE Antennas and Propagation Society)

Volumn 2, Issue , 1993, Pages 982-985

  Katehi, Linda P B ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; ELECTRONICS PACKAGING; MICROWAVE DEVICES;

ELECTROMAGNETIC MODELING;

MONOLITHIC INTEGRATED CIRCUITS;

EID: 0027873631     PISSN: 02724693     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)