A new three dimensional finite difference time domain (3D-FDTD) simulator for modelling electronic interconnections and packaging

IEEE 2nd Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 1993

Volumn , Issue , 1993, Pages 92-95

  Lu, L X ^a   Wu, C ^a   Litva, J ^a  

^a MCMASTER UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMAGNETIC FIELDS; ELECTRONICS PACKAGING; FINITE DIFFERENCE TIME DOMAIN METHOD; PACKAGING;

3D FDTD; ELECTROMAGNETIC PROBLEMS; ELECTRONIC PACKAGING; THREE DIMENSIONAL FINITE DIFFERENCE TIME DOMAINS;

TIME DOMAIN ANALYSIS;

EID: 34648862890     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.1993.394582     Document Type: Conference Paper

References (3)

1. K. S. Yee, "Numerical solution of initial boundary value problems involving in Maxwell's equations in isotropic media", IEEE Trans. AP, Vol. 14 , pp302-307, 1966.
2. Thomas Becks and Ingo Wolff, "Analysis of 3-D Metallization Structures by a Full-Wave Spectra] Domain Technique", IEEE Trans. MTT, Vol. 40, pp2219-2227, 1992.
3. Wiren D. Becker, Pual H. Harms and Raj Mittra, "Time-Domain Electromagnetic Analysis of Interconnects in a Computer Chip Package", IEEE Trans. MTT, Vol. 40, pp2155-2163, 1992