Modeling and analysis of vias in multilayered integrated circuits

IEEE Transactions on Microwave Theory and Techniques

Volumn 41, Issue 2, 1993, Pages 206-214

  Gu, Qizheng ^a   Yang, Y Eric ^a   Tassoudji, M Ali ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EQUIVALENT CIRCUITS; MICROSTRIP DEVICES; MICROWAVE DEVICES; NUMERICAL ANALYSIS; TIME DOMAIN ANALYSIS;

MULTILAYERED INTEGRATED CIRCUITS; THERMAL CONDUCTION MODULES;

INTEGRATED CIRCUITS;

EID: 0027543288     PISSN: 00189480     EISSN: 15579670     Source Type: Journal    
DOI: 10.1109/22.216458     Document Type: Article

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