3D FDTD analysis of a SOT353 package containing a bipolar wideband cascode transistor using the compression approach

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 1995, Pages 1587-1590

  Rittweger, M ^a   Werthen, M ^a   Kunisch, J ^a   Wolff, I ^a   Chall, P ^a   Balm, B ^a   Lok, P ^a  

^a Satellitenfunktechnik ^*  (France)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC VARIABLES MEASUREMENT; ELECTRONICS PACKAGING; FINITE DIFFERENCE METHOD; GATES (TRANSISTOR); PLASTICS APPLICATIONS; SEMICONDUCTOR DEVICE MANUFACTURE; THREE DIMENSIONAL; TIME DOMAIN ANALYSIS;

BIPOLAR WIDEBAND CASCODE TRANSISTOR; CIRCUIT SIMULATOR; ELECTROMAGNETIC SIMULATION; MOLD INJECTED PLASTIC PACKAGE;

BIPOLAR TRANSISTORS;

EID: 0029228248     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)