New approach to signal integrity analysis of high-speed packaging

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1995, Pages 235-238

  Chen, Yuzhe ^a   Chen, Zhaoqing ^a   Wu, Zhonghua ^a   Xue, Danwei ^a   Fang, Jiayuan ^a  

^a BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; COMPUTER AIDED NETWORK ANALYSIS; COMPUTER SIMULATION; DISTRIBUTED PARAMETER NETWORKS; ELECTRIC VARIABLES MEASUREMENT; ELECTROMAGNETIC FIELDS; LUMPED PARAMETER NETWORKS; NETWORK COMPONENTS;

CIRCUIT SIMULATION; ELECTROMAGNETIC FIELD SIMULATION; SIGNAL INTEGRITY ANALYSIS; SIGNAL INTEGRITY PROBLEMS; SIGNAL TRACES;

ELECTRONICS PACKAGING;

EID: 0029507310     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)