Time domain modeling of high-speed circuit structures with TLM

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1996, Pages 196-198

  Hoefer, Wolfgang J R ^a  

^a UNIVERSITY OF VICTORIA   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC NETWORK ANALYSIS; ELECTROMAGNETIC FIELDS; ELECTRONICS PACKAGING; MATHEMATICAL MODELS; PRINTED CIRCUIT DESIGN; TIME DOMAIN ANALYSIS; TRANSMISSION LINE THEORY;

MODE MATCHING; TRANSIENT ELECTROMAGNETIC SIGNALS; TRANSMISSION LINE MATRIX;

PRINTED CIRCUIT BOARDS;

EID: 0030393021     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)