Technique for deriving the equivalent circuit of an SOP package using the FDTD in conjunction with TOUCHSTONE

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1996, Pages 135-137

  Chen, Yinchao ^a   Mittra, Raj ^a   Harms, Paul ^a   Beyene, Wendemagegnehu ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE DIFFERENCE METHOD; FREQUENCY RESPONSE; MATHEMATICAL MODELS; PLASTICS APPLICATIONS; SEMICONDUCTING SILICON; TIME DOMAIN ANALYSIS;

FULL WAVE ANALYSIS; SILICON ON PLASTIC PACKAGE;

EQUIVALENT CIRCUITS;

EID: 0030382287     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)