-
2
-
-
0028515770
-
Furnace grown gate oxynitride using nitric oxide (NO)
-
Y. Okada, P.J. Tobin, K.G. Reid, R.I. Hegde, B. Maiti, and S.A. Ajuria, "Furnace grown gate oxynitride using nitric oxide (NO)", IEEE Trans. Elec. Dev. Vol. 41, 1608, 1994.
-
(1994)
IEEE Trans. Elec. Dev.
, vol.41
, pp. 1608
-
-
Okada, Y.1
Tobin, P.J.2
Reid, K.G.3
Hegde, R.I.4
Maiti, B.5
Ajuria, S.A.6
-
3
-
-
84886448156
-
High performance 20A NO oxynitride for gate dielectric in deep sub-quarter micron CMOS technology
-
B. Maiti, P.J. Tobin, V. Misra, R.I. hegde, K.G. Reid, and C. Gelatos, "High performance 20A NO oxynitride for gate dielectric in deep sub-quarter micron CMOS technology", IEDM Tech. Dig., p. 651, 1997.
-
(1997)
IEDM Tech. Dig.
, pp. 651
-
-
Maiti, B.1
Tobin, P.J.2
Misra, V.3
Hegde, R.I.4
Reid, K.G.5
Gelatos, C.6
-
4
-
-
77957874473
-
2O annealing on MOSFETs
-
2O annealing on MOSFETs", IEDM Tech. Dig., p. 625, 1992.
-
(1992)
IEDM Tech. Dig.
, pp. 625
-
-
Liu, Z.H.1
Krick, J.T.2
Wann, H.J.3
Ko, P.K.4
Hu, C.5
Chen, Y.C.6
-
5
-
-
0029358099
-
2 oxides by direct nitrogen implantation into silicon
-
2 oxides by direct nitrogen implantation into silicon," J. Electrochem. Soc., v. 142, no. 8, p. L132, 1995.
-
(1995)
J. Electrochem. Soc.
, vol.142
, Issue.8
-
-
Soleimani, H.R.1
Doyle, B.S.2
Philipossian, A.3
-
6
-
-
0029723453
-
25A gate oxide without boron penetration for 0.25 and 0.3-μm PMOSFETs
-
C.T. Liu, Y. Ma, K.P. Cheung, C.P. Chang, L. Fritzinger, J. Becerro, H. Luftman, H.M. Vaidya, J.I. Colonell, A. Kamgar, J.F. Minor, R.G. Minor, R.G. Murray, W.Y.C. Lai, S.J. Hillenius, "25A gate oxide without boron penetration for 0.25 and 0.3-μm PMOSFETs", VLSI Tech. Dig., p. 18, 1996.
-
(1996)
VLSI Tech. Dig.
, pp. 18
-
-
Liu, C.T.1
Ma, Y.2
Cheung, K.P.3
Chang, C.P.4
Fritzinger, L.5
Becerro, J.6
Luftman, H.7
Vaidya, H.M.8
Colonell, J.I.9
Kamgar, A.10
Minor, J.F.11
Minor, R.G.12
Murray, R.G.13
Lai, W.Y.C.14
Hillenius, S.J.15
-
8
-
-
22244480327
-
Degradation of oxynitride gate dielectric reliability due to boron diffusion
-
D. Wristers, L.K. Han, T. Chen, H.H. Wang, D.L. Kwong, M. Allen, and J. Fulford, "Degradation of oxynitride gate dielectric reliability due to boron diffusion", Appl. Phys. Lett. vol. 68, p. 2094, 1996.
-
(1996)
Appl. Phys. Lett.
, vol.68
, pp. 2094
-
-
Wristers, D.1
Han, L.K.2
Chen, T.3
Wang, H.H.4
Kwong, D.L.5
Allen, M.6
Fulford, J.7
-
9
-
-
20244380605
-
The impact of nitrogen profile engineering on ultrathin nitrided oxide films
-
E. Hasegawa, M. Kawata, K. Ando, M. Makabe, M. Kitakata, A. Ishitani, L. Machanda, M.L. Green, K.S. Krisch, and L.C. Feldman, "The impact of nitrogen profile engineering on ultrathin nitrided oxide films" in IEDM Tech. Dig., p. 327, 1995.
-
(1995)
IEDM Tech. Dig.
, pp. 327
-
-
Hasegawa, E.1
Kawata, M.2
Ando, K.3
Makabe, M.4
Kitakata, M.5
Ishitani, A.6
Machanda, L.7
Green, M.L.8
Krisch, K.S.9
Feldman, L.C.10
-
10
-
-
0030648916
-
Ultrathin silicon nitride gate dielectric deep-sub-micron CMOS devices
-
M. Khare, X. Guo, X.W. Wang, T.P. Ma, G.J. Cui, T. Tamagawa, B.L. Halpern, and J.J. Schmitt, "Ultrathin silicon nitride gate dielectric deep-sub-micron CMOS devices", VLSI Tech. Symp. Dig., p. 51, (1997).
-
(1997)
VLSI Tech. Symp. Dig.
, pp. 51
-
-
Khare, M.1
Guo, X.2
Wang, X.W.3
Ma, T.P.4
Cui, G.J.5
Tamagawa, T.6
Halpern, B.L.7
Schmitt, J.J.8
-
11
-
-
4244029560
-
Ultra thin (<3 nm) high quality nitride/oxide stack gate dielectrics fabricated by in situ rapid thermal processing
-
B.Y. Kim, H.F. Luan, and D.L. Kwong, "Ultra thin (<3 nm) high quality nitride/oxide stack gate dielectrics fabricated by in situ rapid thermal processing", IEDM Tech. Dig., 463 (1997).
-
(1997)
IEDM Tech. Dig.
, pp. 463
-
-
Kim, B.Y.1
Luan, H.F.2
Kwong, D.L.3
-
12
-
-
84886448029
-
Application of JVD nitride gate dielectric to a 0.35 micron CMOS process for reduction of gate leakage current and boron penetration
-
H.-H. Tseng, P.G.Y. Tsui, P.J. Tobin, J. Mogab, M. Khare, X.W. Wang, T.P. Ma, R. Hegde, C. Hobbs, J. Veteran, M. Hartig, G. Kenig, V. Wang, R. Blumenthal, R. Cotton, V. Kaushik, T. Tamagawa, B.L. Halpern, G.J. Cui, and J.J. Schmitt, "Application of JVD nitride gate dielectric to a 0.35 micron CMOS process for reduction of gate leakage current and boron penetration", IEDM Tech. Dig., 647 (1997).
-
(1997)
IEDM Tech. Dig.
, pp. 647
-
-
Tseng, H.-H.1
Tsui, P.G.Y.2
Tobin, P.J.3
Mogab, J.4
Khare, M.5
Wang, X.W.6
Ma, T.P.7
Hegde, R.8
Hobbs, C.9
Veteran, J.10
Hartig, M.11
Kenig, G.12
Wang, V.13
Blumenthal, R.14
Cotton, R.15
Kaushik, V.16
Tamagawa, T.17
Halpern, B.L.18
Cui, G.J.19
Schmitt, J.J.20
more..
-
13
-
-
0032046459
-
Ultrathin oxide-nitride gate dielectric MOSFETs
-
C. G. Parker, G. Lucovsky, and J.R. Hauser, "Ultrathin oxide-nitride gate dielectric MOSFETs", Elec. Dev. Lett. 19(4), 106 (1998).
-
(1998)
Elec. Dev. Lett.
, vol.19
, Issue.4
, pp. 106
-
-
Parker, C.G.1
Lucovsky, G.2
Hauser, J.R.3
-
14
-
-
36449005178
-
Controlled incorporation of N at the gate oxide surface
-
S.V. Hattangady, H. Niimi, and G. Lucovsky, "Controlled incorporation of N at the gate oxide surface", Appl. Phys. Lett., vol. 66, pp. 3495, 1995.
-
(1995)
Appl. Phys. Lett.
, vol.66
, pp. 3495
-
-
Hattangady, S.V.1
Niimi, H.2
Lucovsky, G.3
-
15
-
-
0030386820
-
Ultrathin nitrogen-profile engineered gate dielectric films
-
S.V. Hattangady, R. Kraft, D.T. Grider, G.A. Brown, P.A. Tiner, J.W. Kuehne, P.E. Nicollian, and M.F. Pas, "Ultrathin nitrogen-profile engineered gate dielectric films", IEDM Tech. Dig., p. 495, 1996.
-
(1996)
IEDM Tech. Dig.
, pp. 495
-
-
Hattangady, S.V.1
Kraft, R.2
Grider, D.T.3
Brown, G.A.4
Tiner, P.A.5
Kuehne, J.W.6
Nicollian, P.E.7
Pas, M.F.8
-
16
-
-
0030655686
-
A 0.18um CMOS process using nitrogen-profile engineered gate dielectrics
-
D.T. Grider, S.V. Hattandady, R. Kraft, P.E. Nicollian, J. Kuehne, G. Brown, S. Aur, R.H. Eklund, M.F. Pas, W.R. Hunter, and M. Douglas, "A 0.18um CMOS process using nitrogen-profile engineered gate dielectrics", 1997 Symp. VLSI Tech., p. 47, 1997.
-
(1997)
1997 Symp. VLSI Tech.
, pp. 47
-
-
Grider, D.T.1
Hattangady, S.V.2
Kraft, R.3
Nicollian, P.E.4
Kuehne, J.5
Brown, G.6
Aur, S.7
Eklund, R.H.8
Pas, M.F.9
Hunter, W.R.10
Douglas, M.11
-
17
-
-
0000018164
-
Surface nitridation of silicon dioxide with a high-density nitrogen plasma
-
R. Kraft, T.P. Schneider, W.W. Dostalik, and S. Hattangady, "Surface nitridation of silicon dioxide with a high-density nitrogen plasma", J. Vac. Sci. Technol. B, vol. 15, 967, 1997.
-
(1997)
J. Vac. Sci. Technol. B
, vol.15
, pp. 967
-
-
Kraft, R.1
Schneider, T.P.2
Dostalik, W.W.3
Hattangady, S.4
-
18
-
-
0012204088
-
Monitoring plasma damage: A real-time, noncontact approach
-
A.M. Hoff, T.C. Esry, and K. Nauka, "Monitoring plasma damage: a real-time, noncontact approach", Solid St. Tech. v. 39, p. 139 (1996).
-
(1996)
Solid St. Tech.
, vol.39
, pp. 139
-
-
Hoff, A.M.1
Esry, T.C.2
Nauka, K.3
-
19
-
-
84886448006
-
Sub-100 nm gate length metal gate NMOS transistors fabricated by a replacement gate process
-
A. Chatterjee, R.A. Chapman, G. Dixit, J. Kuehne, S. Hattangady, H. Yang, G.A. Brown, R. Aggarwal, U. Erdogan, Q. He, M. Hanratty, S. Murtaza, S. Fang, R. Kraft, A. Rotundaro, J. Hu, M. Terry, W. Lee, C. Fernando, A. Konecni, G. Wells, D. Frystak, C. Bowen, M. Rodder, and I-C. Chen, "Sub-100 nm gate length metal gate NMOS transistors fabricated by a replacement gate process", IEDM Tech. Dig., 821 (1997).
-
(1997)
IEDM Tech. Dig.
, pp. 821
-
-
Chatterjee, A.1
Chapman, R.A.2
Dixit, G.3
Kuehne, J.4
Hattangady, S.5
Yang, H.6
Brown, G.A.7
Aggarwal, R.8
Erdogan, U.9
He, Q.10
Hanratty, M.11
Murtaza, S.12
Fang, S.13
Kraft, R.14
Rotundaro, A.15
Hu, J.16
Terry, M.17
Lee, W.18
Fernando, C.19
Konecni, A.20
Wells, G.21
Frystak, D.22
Bowen, C.23
Rodder, M.24
Chen, I.-C.25
more..
-
20
-
-
84886448019
-
Feasibility of using W/TiN as metal gate for conventional 0.13um CMOS technology and beyond
-
J.C. Hu, H. Yang, R. Kraft, A.L.P. Rotondaro, S. Hattangady, W.W. Lee, R.A. Chapman, C.-P. Chao, A. Chatterjee, M. Hanratty, and I.-C. Chen, "Feasibility of using W/TiN as metal gate for conventional 0.13um CMOS technology and beyond", IEDM Tech. Dig., 825 (1997).
-
(1997)
IEDM Tech. Dig.
, pp. 825
-
-
Hu, J.C.1
Yang, H.2
Kraft, R.3
Rotondaro, A.L.P.4
Hattangady, S.5
Lee, W.W.6
Chapman, R.A.7
Chao, C.-P.8
Chatterjee, A.9
Hanratty, M.10
Chen, I.-C.11
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