Effect of processing on the overlay performance of a wafer stepper

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3050, Issue , 1997, Pages 102-113

  Dirksen, Peter ^a   Juffermans, Casper A H ^a   Leeuwestein, A ^a   Mutsaers, Kees A H ^a   Nuijs, Tom A M ^a   Pellens, Rudy J M ^a   Wolters, Robert ^a   Gemen, Jack ^b  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b ASML   (Netherlands)

Author keywords

Alignment; Overlay; Processing; Simulation

Indexed keywords

ALIGNMENT; ALUMINA; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING;

ALUMINUM SPUTTERING; DEPOSITION EXPERIMENTS; OVERLAY; PROCESSING CONDITIONS; SIMULATION; SYSTEM MODELING; VECTOR MAPS; WAFER STEPPERS;

PROCESS CONTROL;

EID: 0001556151     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.275950     Document Type: Conference Paper

References (22)

1. "Contrast improvement of alignment signals from resist coated patterns", S. Kuniyoshi, T. Terasawa, T. Kurosaki, T. Kimura, J.Vac.Sci.Technol B, 1987, 555
2. "Broadband alignment scheme for a stepper system using combination of diffractive and refractive lens", Y. Yoshitake and G.M. Morris, Applied Optics, 1994, (33), 7971
3. "Optical alignment for lithography", N. Bobroff and A. Rosenbluth, OSA Proc on soft-X-Ray projection lithography, 1991, (12) 42
4. "Improving ASM stepper alignment accuracy by alignment signal intensity simulation", G. Li, S. Pushpala, B. Bradford, Z. Peng, M. Gottipati, SPIE Vol. 1926, 1993, 115
5. "Top antireflector process for improved linewidth control and alignment", T.A. Brunner, C.F. Lyons, S.S. Miura, J.Vac.Sci.Technol B, 1991, 3418
6. "The use of a non-actinic dye in a conventional positive photo resist for improved alignment in the dark field mode", D. Sawoska, SPIE Vol. 922, 1988, 217
7. "Photoresist thin-film effects on alignment process capabilities", G. Flores, W.W. Flack, SPIE Vol. 1927, 1993, 367
8. "Photo ablation of resist coated alignment targets to improve VSLI pattern overlay", D.J. Elliott, et. al. SPIE Vol. 774, 1987, 172
9. "Parameters affecting alignment dispersion on an optical wafer stepper", A. Charles, SPIE Vol. 1138, 1989, 64
10. "In-line overlay measurement for advanced photolithography", E. Rouchez, D. Burlet, J-M. Dumant, SPIE Vol. 2725, 1996, 331
11. "Improved overlay measurements of CMP process layers", J.H. Yeo, SPIE Vol. 2725, 1996, 345
12. "Phase gratings as waferstepper alignment marks for all process layers", S. Wittekoek, J. v.d. Werf and R.A. George, SPIE Vol. 538, 1985, 24
13. "Thin film optical filters", H.A. Macleod, published by Adam Huger Ltd, 1986
14. "Alignment errors from resist coating topography", N. Bobroff, A. Rosenbluth, J.Vac.Sci.Technol B, 1988, 403
15. "Modeling optical equipment for wafer stepper alignment and line width measurement", C.M. Yuan, IEEE Trans Sem. Man. (4) 1991, 99
16. "An empirical model for planarization with polymer solutions", A. Schilts, Jpn. J. Appi. Phys. Vol. 34, 1995, 4185
17. "New evaluation method of resist coating using heterodyne holographic wafer alignment", K. Yamashita, N. Nomura, Japn. J. Appl. Phys. 1994, 3873
18. "Influence of apparatus geometry and deposition conditions on the structrure and topography of thick sputtered coatings", J.A. Thornton, J. Vac. Sci. Technol. (11) 1974, 666
19. "Evaporated film profiles over steps in substrates", l.A. Blech, Thin Solid Films, (6) 1970, 113
20. B. Katz from ASML, private communication.
21. "Application of chemical mechanical polishing to the fabrication of VLSI Circuit interconnects", W.J. Patrick, W.L. Guthrie, C.L. Standley, P.M. Schiable, J. Electrochem. Soc. Vol. 138, 1991, 1778
22. "CMP compatible alignment strategy", E. Rouchouze, J.M. Darracq, J. Gemen, This conference.