Evaporated film profiles over steps in substrates

Thin Solid Films

Volumn 6, Issue 2, 1970, Pages 113-118

  Blech, I A ^a  

^a Research and Development Laboratory   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0007026856     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/0040-6090(70)90068-4     Document Type: Article

References (4)

1. A Failure Mechanism of Semiconductor Devices and its Analysis
2. Thermal effects on the integrity of aluminum to silicon contacts in silicon integrated circuits