-
2
-
-
0032255794
-
-
D. Park, Q. Lu, T.-J. King, C. Hu, A. Kalnitsky, S.-P. Tay, and C.-C. Cheng, Tech. Dig. Int. Electron Devices Meet. 1998, 381.
-
Tech. Dig. Int. Electron Devices Meet.
, vol.1998
, pp. 381
-
-
Park, D.1
Lu, Q.2
King, T.-J.3
Hu, C.4
Kalnitsky, A.5
Tay, S.-P.6
Cheng, C.-C.7
-
5
-
-
0031547317
-
-
S. Miayazaki, H. Nishimura, M. Fukuda, L. Ley, and J. Ristein, Appl. Surf. Sci. 113/114, 585 (1997).
-
(1997)
Appl. Surf. Sci.
, vol.113-114
, pp. 585
-
-
Miayazaki, S.1
Nishimura, H.2
Fukuda, M.3
Ley, L.4
Ristein, J.5
-
8
-
-
0031653670
-
-
IEEE, Piscataway, NJ
-
T. Nigam, R. Degraeve, G. Groeseneken, M. M. Heyns, and H. E. Maes, International Reliability Physics Proceedings (IEEE, Piscataway, NJ, 1998), p. 62.
-
(1998)
International Reliability Physics Proceedings
, pp. 62
-
-
Nigam, T.1
Degraeve, R.2
Groeseneken, G.3
Heyns, M.M.4
Maes, H.E.5
-
11
-
-
0027629015
-
-
C. Monserie, P. Mortini, G. Ghibaudo, and G. Pananakakis, Qual. Reliab. Eng. Int. 9, 321 (1993).
-
(1993)
Qual. Reliab. Eng. Int.
, vol.9
, pp. 321
-
-
Monserie, C.1
Mortini, P.2
Ghibaudo, G.3
Pananakakis, G.4
-
13
-
-
0023386518
-
-
C.-F. Chen, C.-Y. Wu, M.-K. Lee, and C.-N. Chen, IEEE Trans. Electron Devices ED-34, 1540 (1987).
-
(1987)
IEEE Trans. Electron Devices
, vol.ED-34
, pp. 1540
-
-
Chen, C.-F.1
Wu, C.-Y.2
Lee, M.-K.3
Chen, C.-N.4
-
15
-
-
0000526980
-
-
T. Y. Chu, W. Ting, J. H. Ahn, S. Lin, and D. L. Kwong, Appl. Phys. Lett. 59, 1412 (1991).
-
(1991)
Appl. Phys. Lett.
, vol.59
, pp. 1412
-
-
Chu, T.Y.1
Ting, W.2
Ahn, J.H.3
Lin, S.4
Kwong, D.L.5
-
19
-
-
0028515004
-
-
D. J. Dumin, J. R. Maddux, R. S. Scott, and R. Subramonian, IEEE Trans. Electron Devices ED-41, 1570 (1994).
-
(1994)
IEEE Trans. Electron Devices
, vol.ED-41
, pp. 1570
-
-
Dumin, D.J.1
Maddux, J.R.2
Scott, R.S.3
Subramonian, R.4
-
20
-
-
0029514106
-
-
R. Degraeve, G. Groeseneken, R. Bellens, M. Depas, and H. E. Maes, Tech. Dig. Int. Electron Devices Meet. 1995, 863.
-
Tech. Dig. Int. Electron Devices Meet.
, vol.1995
, pp. 863
-
-
Degraeve, R.1
Groeseneken, G.2
Bellens, R.3
Depas, M.4
Maes, H.E.5
-
23
-
-
3343006353
-
-
F. J. Himpsel, F. R. McFeely, A. Taleb-Ibrahimi, J. A. Yarmoff, and G. Hollinger, Phys. Rev. B 38, 6084 (1988).
-
(1988)
Phys. Rev. B
, vol.38
, pp. 6084
-
-
Himpsel, F.J.1
McFeely, F.R.2
Taleb-Ibrahimi, A.3
Yarmoff, J.A.4
Hollinger, G.5
-
24
-
-
0001553830
-
-
J. T. Fitch, C. H. Bjorkman, G. Lucovsky, F. H. Pollak, and X. Yin, J. Vac. Sci. Technol. B 7, 775 (1989).
-
(1989)
J. Vac. Sci. Technol. B
, vol.7
, pp. 775
-
-
Fitch, J.T.1
Bjorkman, C.H.2
Lucovsky, G.3
Pollak, F.H.4
Yin, X.5
-
25
-
-
85037518223
-
-
note
-
2/Si interface for 2.4-nm-thick Dry and RTO, respectively. It is well expected that the oxide with higher film density suffers from the larger compressive strain.
-
-
-
-
27
-
-
0001132960
-
-
IEEE, Piscataway, NJ
-
H. Satake and A. Toriumi, International Reliability Physics Proceedings (IEEE, Piscataway, NJ, 1997), p. 156.
-
(1997)
International Reliability Physics Proceedings
, pp. 156
-
-
Satake, H.1
Toriumi, A.2
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