Effectiveness of reactive sputter-deposited Ta-N films as diffusion barriers for Ag metallization

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 5, 2004, Pages 2345-2352

  Adams, Daniel ^a   Malgas, Gerald F ^a   David Theodore, N ^b   Gregory, Rich ^b   Kim, H C ^c   Misra, E ^c   Alford, T L ^c   Mayer, J W ^c  

^a UNIVERSITY OF THE WESTERN CAPE   (South Africa)

^b MOTOROLA INC   (United States)

^c Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION BARRIERS; PHASE FORMATION; SHEET RESISTANCE MEASUREMENTS; TANTALUM NITRIDE FILMS;

ADHESION; ANNEALING; COMPOSITION; DIFFUSION; METALLIZING; MICROSTRUCTURE; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SILICON; SILVER; SPUTTER DEPOSITION; STOICHIOMETRY; TANTALUM COMPOUNDS; THERMODYNAMIC STABILITY; VACUUM APPLICATIONS; X RAY DIFFRACTION ANALYSIS;

METALLIC FILMS;

EID: 9744271733     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1787521     Document Type: Article

References (37)

1. T. L. Alford, L. Chen, and K. Gadre, Thin Solid Films 429, 248 (2003).
2. Y. C. Peng, C. R. Chen, and L. J. Chen, J. Mater. Res. 13, 90 (1998).
3. C. Y. Hong, Y. C. Peng, L. J. Chen, W. Y. Hsieh, and Y. F. Hsieh, J. Vac. Sci. Technol. A 17, 1911 (1999).
4. M.-A. Nicolet, Thin Solid Films 52, 415 (1978).
5. G. S. Chen, P. Y. Lee, and S. T. Chen, Thin Solid Films 353, 264 (1999).
6. T. Oku, E. Kawakami, M. Uekubo, K. Takahiro, S. Yamaguchi, and M. Murakami, Appl. Surf. Sci. 99, 265 (1996).
7. S. L. Cho, K. B. Kim, S. H. Min, H. K. Shin, and S. D. Kim, J. Electrochem. Soc. 146, 3724 (1999).
8. J. C. Lin and C. Lee, J. Electrochem. Soc. 146, 3466 (1999).
9. K. Holloway, P. M. Fryer, C. Cabral, J. M. E. Harper, P. J. Bailey, and K. H. Kelleleher, J. Appl. Phys. 71, 5433 (1992).
10. L. E. Thod, Transition Metals Carbides and Nitrides (Academic, New York, 1971).
11. A. Noya, K. Sasaki, and M. Takeyama, Jpn. J. Appl. Phys., Part 1 32, 911 (1993).
12. J. C. Lin and C. Lee, J. Electrochem. Soc. 147, 713 (2000).
13. W. L. Yang, W. F. Wu, D.-G. Liu, C.-C. Wu, and K. L. Ou, Solid-State Electron. 45, 149 (2001).
14. M. Stavrev, D. Fischer, C. Wenzel, K. Drescher, and N. Mattern, Thin Solid Films 307, 79 (1997).
15. K.-H. Min, K.-C. Chun, and K.-B. Kim, J. Vac. Sci. Technol. B 14, 3263 (1996).
16. G. S. Chen and S. T. Chen, J. Appl. Phys. 87, 8473 (2000).
17. L. A. Clevenger, N. A. Bojarczuk, K. Holloway, J. M. E. Happer, C. Cabral, Jr., R. G. Schad, F. Cardone, and L. Stolt, J. Appl. Phys. 73, 300 (1993).
18. M. Takeyama, A. Noya, T. Sase, and A. Ohta, J. Vac. Sci. Technol. B 14, 674 (1996).
19. M. T. Wang, Y. C. Lin, and M. C. Chen, J. Electrochem. Soc. 145, 2538 (1998).
20. L. R. Doolittle, Nucl. Instrum. Methods Phys. Res. B 9, 344 (1985).
21. Joint Committee for Powder Diffraction Standard (JCPDS ICDD cards # 25-1280, 26-0985, 32-1282, 25-1278, 14-0471, 31-1370 & 32-1283), PDF Database, 1994.
22. M. Ohring, The Materials Science of Thin Films (Academic, New York, 1992).
23. Y. Kuo, J. J. Huang, S. Lin, C. Lee, and W. Lee, Mater. Chem. Phys. 80, 690 (2003).
24. Constitution of Binary Alloys, edited by M. Hansen and K. Anderko (McGraw-Hill, New York, 1958), p. 987.
25. C. Chang, J. S. Jeng, and J. S. Chen, Thin Solid Films 413, 46 (2002).
26. N. Maracel, E. Quesnel, and Y. Pauleau, J. Electrochem. Soc. 141, 1693 (1994).
27. X. Sun, E. Kolawa, J.-S. Chen, J. S. Reid, and M.-A. Nicolet, Thin Solid Films 236, 347 (1993).
28. K. Radhakrishnanm, N. G. Ing, and R. Gopalakrishnan, Mater. Sci. Eng., B 57, 224 (1999).
29. H. B. Nie, S. Y. Xu, S. J. Wang, L. P. You, Z. Yang, C. K. Ong, J. Li, and T. Y. F. Liew, J. Appl. Phys. 73 229 (2001).
30. H. J. Goldschmidt, Interstitial Alloys (Plenum, New York, 1967).
31. S. P. Murarka, Suicides for VLSI Applications (Academic, New York, 1983).
32. M. Hecker et al., Thin Solid Films 414, 184 (2002).
33. N. G. Einspruch, VLSI Electronics Microstructure Science 15 (Academic, New York, 1987).
34. C. Yang, J. S. Jeng, and J. S. Chen, Thin Solid Films 240-241, 398 (2002).
35. K. T. Miller, F. F. Lange, and D. B. Marshall, J. Mater. Res. 5, 151 (1990).
36. J. J. Rha and J. K. Park, J. Appl. Phys. 82, 1608 (1997).
37. E. Misra, Y. Wang, N. D. Theodore, and T. L. Alford, Thin Solid Films (in press)