Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules

Microelectronics Reliability

Volumn 54, Issue 9-10, 2014, Pages 1856-1861

  Dugal, F ^a,b   Ciappa, M ^b  

^a ABB SWITZERLAND LTD   (Switzerland)

^b ETH ZURICH   (Switzerland)

Author keywords

IGBT module; PbSnAg; Solder degradation

Indexed keywords

ELECTRIC POWER SYSTEMS; ELECTRONICS PACKAGING; INTERMETALLICS; LEAD; POLYCHLORINATED BIPHENYLS; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; THERMAL CYCLING;

FAILURE MECHANISM; GROWTH OF INTERMETALLICS; IGBT-MODULES; INTER-METALLIC PARTICLE; INTERMETALLIC LAYER; INTERMETALLIC PHASIS; JUNCTION TEMPERATURES; PBSNAG;

TIN;

EID: 85027951446     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2014.08.001     Document Type: Conference Paper

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