Lifetime analysis of solder joints in high power IGBT modules for increasing the reliability for operation at 150 °C

Microelectronics Reliability

Volumn 48, Issue 8-9, 2008, Pages 1161-1166

  Feller, L ^a   Hartmann, S ^a   Schneider, D ^a  

^a ABB SWITZERLAND LTD   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE FILTERS; BRAZING; INSULATED GATE BIPOLAR TRANSISTORS (IGBT); RELIABILITY; RELIABILITY ANALYSIS; TECHNOLOGY;

CRITICAL DESIGN; DESIGN MODIFICATIONS; HIGH POWERS; JUNCTION TEMPERATURES; LIFE-TIME ANALYSIS; OPERATING TEMPERATURES; PACKAGING TECHNOLOGIES; SOLDER JOINTS; STATE-OF-THE-ART TECHNOLOGIES;

WELDING;

EID: 50249097670     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.07.019     Document Type: Article

References (11)

1. Schlapbach U, Rahimo M, von Arx C, Mukhitdinov A, Linder S. 1200V IGBTs operating at 200 °C? An investigation on the potentials and the design constraints. In: 19th international symposium on power semiconductor devices and IC's, ISPSD; 2007. p. 9-12.
2. Guth K, Mahnke P. Improving the thermal reliability of large area solder joints in IGBT power modules. In: Fourth international conference on integrated power systems, CIPS; 2006.
3. Lutz J, Herrmann T, Feller M, Bayerer R, Licht T. Power cycling induced failure mechanisms in the viewpoint of rough temperature environment. In: European conference on power electronics and applications; 2007.
4. Röllig M, Wiese S, Meier K, Wolter K-J. Creep measurements of 200-400 μm solder joints. In: International conference on thermal, mechanical and multi-physics simulation experiments in microelectronics and micro-systems, EuroSime; 2007.
5. Wong B., Hellig D.E., and Clark R.W. A creep-rupture model for two-phase eutectic solders. IEEE Trans Comp, hybrids, Manuf Technol 11 (1988) 284-290
6. Schubert A., Walter H., Dudek R., Michel B., Lefranc G., Otto J., et al. Thermo-mechanical properties and creep deformation of lead-containing and lead-free solders. Int Sympos Adv Packaging Mater (2001) 129-134
7. Sun P., Andersson C., Wei X., Cheng Z., Shangguan D., and Liu J. Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate. J Alloy Compd 437 (2007) 169-179
8. Laurila T., Mattila T., Vuorinen V., Karppinen J., Li J., Sippola M., et al. Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests. Microelectron Reliab 47 (2007) 1135-1144
9. Huang Z., Conway P.P., and Thomson R.C. Microstructural considerations for ultrafine lead free solder joints. Microelectron Reliab 47 (2007) 1997-2006
10. Hamidi A, Fabian JH, Gunturi S. Packaging-related failure mechanisms of high power IGBT modules. In: The 2005 international power electronics conference; 2005. p. 1163-68.
11. Dutta I, Pan D, Jadhav S. Impression creep testing and microstructurally adaptive creep modeling of lead free solder interconnections. In: International conference on thermal, mechanical, and multiphysics simulation and experiments in micro-electronics and micro-systems, EUROSIME; 2005. p. 641-7.