Avoiding misleading artefacts in metallurgical preparation of die attach solder joints in high power modules

Microelectronics Reliability

Volumn 53, Issue 9-11, 2013, Pages 1403-1408

  Dugal, Franc ^a,b   Ciappa, Mauro ^b  

^a ABB SWITZERLAND LTD   (Switzerland)

^b ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

DIAMOND WIRE SAWING; HIGH POWER MODULE; HIGH-POWER DEVICES; MULTIPLE LAYERS; OPERATING LIFE; SOLDER JOINTS; THERMO MECHANICAL FATIGUES (TMF); WATERJET CUTTING;

CUTTING; JETS;

ELECTRIC POWER SYSTEMS;

EID: 84886923997     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2013.07.064     Document Type: Conference Paper

References (13)

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