An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications

Microelectronics Reliability

Volumn 49, Issue 9-11, 2009, Pages 1370-1374

  Micol, A ^a   Zeanh, A ^a,b,d   Lhommeau, T ^c   Azzopardi, S ^d   Woirgard, E ^d   Dalverny, O ^a   Karama, M ^a  

^a UNIVERSITÉ DE TOULOUSE   (France)

^b PEARL   (France)

^c SAFRAN AIRCRAFT ENGINES   (France)

^d UNIVERSITÉ DE BORDEAUX   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATED AGEING TESTS; AERONAUTICAL APPLICATIONS; BASEPLATE; CRITICAL POINTS; POWER MODULE; PROBABILISTIC FINITE ELEMENTS; TEMPERATURE CYCLING; TEST VEHICLE; WORKING ENVIRONMENT;

EQUATIONS OF STATE; TESTING;

THERMAL FATIGUE;

EID: 69349090740     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.06.046     Document Type: Article

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