Computational fluid dynamics for thermal performance of a water-cooled minichannel heat sink with different chip arrangements

International Journal of Numerical Methods for Heat and Fluid Flow

Volumn 24, Issue 4, 2014, Pages 797-810

  Xie, Gongnan ^a   Li, Shian ^a   Sunden, Bengt ^b   Zhang, Weihong ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

^b LUND UNIVERSITY   (Sweden)

Author keywords

Chip Arrangement; Heat Sink; Minichannel; Thermal Performance

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COOLING; HEAT FLUX; THERMODYNAMIC PROPERTIES; THERMOELECTRIC EQUIPMENT;

CHIP ARRANGEMENT; CONVECTIVE HEAT TRANSFER COEFFICIENT; COOLING REQUIREMENTS; DESIGN/METHODOLOGY/APPROACH; MINI CHANNELS; PARALLEL ARRANGEMENT; THERMAL PERFORMANCE; TURBULENCE SIMULATION;

HEAT SINKS;

EID: 84899856442     PISSN: 09615539     EISSN: None     Source Type: Journal    
DOI: 10.1108/HFF-01-2013-0013     Document Type: Conference Paper

References (24)

1. Chen, C.H. (2007), "Forced convection heat transfer in microchannel heat sinks,", International Journal of Heat and Mass Transfer, Vol. 50 Nos 11-12, pp. 2182-2189.
2. Cho, E.S., Choi, J.W., Yoon, J.S. and Kim, M.S. (2010), "Modeling and simulation on the mass flow distribution in microchannel heat sinks with non-uniform heat flux conditions,", International Journal of Heat and Mass Transfer, Vol. 53 Nos 7-8, pp. 1341-1348.
3. Farnam, D., Sammakia, B., Ackler, H. and Ghose, K. (2009), "Comparative analysis of microchannel heat sink configurations subject to a pressure constraint,", Heat Transfer Engineering, Vol. 30 Nos 1-2, pp. 43-53.
4. Kandasamy, R. and Subramanyam, S. (2005), "Application of computational fluid dynamics simulation tools for thermal characterization of electronic packages,", International Journal of Numerical Methods for Heat Fluid Flow, Vol. 15 No. 1, pp. 61-72.
5. Kandlikar, S.G. and Grande, W.J. (2004), "Evaluation of single phase flow in microchannels for high flux chip cooling - thermohydraulic performance enhancement and fabrication technology,", Heat Transfer Engineering, Vol. 25 No. 8, pp. 5-16.
6. Khan, W.A., Culham, J.R. and Yovanovich, M.M. (2009), "Optimization of microchannel heat sinks using entropy generation minimization method,", IEEE Transactions on Components and Packaging Technologies, Vol. 32 No. 2, pp. 243-251.
7. Kumaraguruparan, G. and Sornakumar, T. (2010), "Development and testing of aluminum micro channel heat sink,", Journal of Thermal Science, Vol. 19 No. 3, pp. 245-252.
8. Lan, J.B., Xie, Y.H. and Zhang, D. (2012), "Flow and heat transfer in microchannels with dimples and protrusions,", ASME Journal of Heat Transfer, Vol. 134 No. 2, pp. 021901-1-021901-9.
9. Lelea, D. (2009), "The heat transfer and fluid flow of a partially heated microchannel heat sink,", International Communications in Heat and Mass Transfer, Vol. 36 No. 8, pp. 794-798.
10. Levac, M.L., Soliman, H.M. and Ormiston, S.J. (2011), "Three-dimensional analysis of fluid flow and heat transfer in single- and two-layered micro-channel heat sinks,", Heat and Mass Transfer, Vol. 47 No. 11, pp. 1375-1383.
11. Manglik, R.M., Zhang, J. and Muley, A. (2005), "Low Reynolds number forced convection in three-dimensional wavy-plate-fin compact channels: fin density effects,", International Journal of Heat and Mass Transfer, Vol. 48 No. 8, pp. 1439-1449.
12. Naphon, P., Klangchart, S. and Wongwises, S. (2009), "Numerical investigation on the heat transfer and flow in the mini-fin heat sink for CPU,", International Communications in Heat and Mass Transfer, Vol. 36 No. 8, pp. 834-840.
13. Qu, W. and Mudawar, I. (2002), "Analysis of three-dimensional heat transfer in microchannel heat sinks,", International Journal Heat and Mass Transfer, Vol. 45 No. 19, pp. 3973-3985.
14. Quadir, G.A., Mydin, A. and Seetharamu, K.N. (2000), "Analysis of microchannel heat exchangers using FEM,", International Journal of Numerical Methods for Heat Fluid Flow, Vol. 11 No. 1, pp. 59-76.
15. Shao, B.D., Wang, L.F., Li, J.Y. and Sun, Z.W. (2009), "Application of thermal resistance network model in optimization design of micro-channel cooling heat sink,", International Journal of Numerical Methods for Heat Fluid Flow, Vol. 19 No. 3, pp. 535-545.
16. Shao, B.D., Wang, L.F., Li, J.Y. and Cheng, H.M. (2011), "Multi-objective optimization design of a micro-channel heat sink using adaptive genetic algorithm,", International Journal of Numerical Methods for Heat Fluid Flow, Vol. 21 No. 3, pp. 353-364.
17. Steinke, M.E., Kandlikar, S.G., Magerlein, J.H., Colgan, E.G. and Raisanen, A.D. (2006), "Development of an experimental facility for investigating single-phase liquid flow in microchannels,", Heat Transfer Engineering, Vol. 27 No. 4, pp. 41-52.
18. Tuckerman, D.B. and Pease, R.F.W. (1981), "High-performance heat sinking for VLSI,", IEEE Electron Device Letters, Vol. EDL-2 No. 5, pp. 126-129.
19. Xie, G.N., Liu, Y.Q., Zhang, W.H. and Sunden, B. (2013a), "Computational study and optimization of laminar heat transfer and pressure loss of double-layer microchannels for chip liquid cooling,", ASME Journal of Thermal Science and Engineering Applications, Vol. 5 No. 1, Paper no. 011004.
20. Xie, G.N., Liu, J., Zhang, W.H. and Sunden, B. (2013b), "Analysis of flow and thermal performance of a water-cooled transversal wavy microchannel heat sink for chip cooling,", ASME Journal of Electronic Packaging, Vol. 134.
21. Xie, G.N., Chen, Z.Y., Sunden, B. and Zhang, W.H. (2013c), "Numerical predictions of flow and thermal performance of water-cooled single-layer and double-layer wavy microchannel heat sinks,", Numerical Heat Transfer-Part A, Vol. 63 No. 3, pp. 201-225.
22. Xie, G.N., Chen, Z.Y., Zhang, W.H. and Sunden, B. (2013d), "Comparative study of flow and thermal performance of liquid-cooling parallel-flow and counter-flow double-layer wavy microchannel heat sinks,", Numerical Heat Transfer-Part A, Vol. 64 No. 1, pp. 30-55.
23. Xie, X.L., Tao, W.Q. and He, Y.L. (2007), "Numerical study of turbulent heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink,", ASME Journal of Electronic Packaging, Vol. 129 No. 3, pp. 247-255.
24. Xie, X.L., Liu, Z.J., He, Y.L. and Tao, W.Q. (2009), "Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink,", Applied Thermal Engineering, Vol. 29 No. 1, pp. 64-74.